Micro Devices is a UK company specialising in the design and manufacture of low cost polymer semiconductor packaging solutions for micro-components, chip and wire devices and SMD components.

We have extensive experience in the design, layout and manufacture of packages for micro-assemblies including chip and wire semiconductor packages and substrates; in particular the advanced package for electronic components (APEC).

As well as the APEC the company also manufactures Chip on Board (COB) substrates, Micro-modules and versions of MCM-L products. The APEC style of package has significant advantages over ceramic products including reduced weight, decreased size, higher interconnect density and lower costs.

A major advantage is they have near perfect thermal match to the mounting PCB and the superior electrical characteristics give faster rise times and lower propagation delay. The standard product has typical thermal resistance of 92ºC/W but with design additions can be reduced to 10ºC/W