Micro Devices Limited Micro Devices Limited
Packages for the Semiconductor & Micro Electronics industries
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Advanced Package for Electronic Components |
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| APEC | |||||
Examples of APEC Standard Outline Packages
| We can supply a range of Standard Outline Leadless Packages. See our Data Sheet for details of the range and specifications. |
Key Benefits |
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Lower Costs
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Reduced Weight
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Rugged Construction
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Low propagation delay
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High Pin count capability
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Meets JEDEC footprint requirement
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Thermal matching to pcb
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Tight dimensional tolerances. |
Download Fact Sheet by clicking here: Standard APEC Data Sheet