Micro Devices Limited

Packages for the Semiconductor & Micro Electronics industries

Custom APEC

 

      
     Examples of custom APECs

Custom or Semi Custom APECs (Advanced Packages for Electronic Components) are highly reliable leadless chip carrier packages constructed from Polymer materials that are designed and manufactured by MDL to a specific customer requirement. Download our Data Sheet below.

Key Benefits
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Lower costs
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Reduced weight
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Very rugged construction
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Fully or semi-customised high density interconnect
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Customer specific or JEDEC footprint
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Thermal matching to PCB
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Tight dimensional tolerances

 

Additional Features
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Photo solder masking

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Up to 8 metallised layers

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Low thermal designs

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Electrical screening

Download Data Sheet by clicking here: Custom APEC Data Sheet

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