Micro Devices Limited Micro Devices Limited
Packages for the Semiconductor & Micro Electronics industries
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Chip on Board |
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Examples of Chip on Board devices
| Chip on Board (COB) offers potentially smaller, cheaper and more powerful designs compared to conventional through-hole assembly techniques and surface mount. Download our Chip on Board Data Sheet below |
| Key Benefits | |
 | Lower costs |
| Reduced weight |
| Very rugged construction |
| Range of substrates |
| Tight dimensional tolerances |
| Multilayer metallization available |
| Additional Features | |
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Photo solder masking |
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Multilayer metallization available |
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Die attach using conductive or non-conductive adhesive |
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Gold thermosonic or Aluminium ultrasonic wire bondable finish available |
Download Data Sheet by clicking here: Chip On Board Data Sheet
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