Micro Devices Limited Micro Devices Limited
Packages for the Semiconductor & Micro Electronics industries
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Multi Chip Module |
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Examples of Multi Chip Modules
Multi chip modules can integrate a combination of chip and wire devices and conventional surface mount components into one package. The package interconnects based on multilayer PCB technology offer significant advantages over ceramic hybrid packages: |
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More economical |
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Lower weight |
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Matches Mounting PCB Thermal characteristics |
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Sturdy construction |
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Fully customizable interconnect |
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Customer specific or JEDEC footprint |
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Multilayer metallization available |
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Supplied as single units or arrays for large area assembly |
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Solder mask options available |
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Die attach using conductive or non-conductive adhesive |
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Gold thermosonic or Aluminium ultrasonic wire bondable finish available |
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Chip protection with Epoxy, Silicone Gel or ‘B’ stage epoxy lid |
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Lid seal with pre-screened B stage epoxy, oven cured |
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Surface mount - solder attach using conventional IR Reflow |
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