- Standard APEC
- A range of standard outline high reliability leadless chip carriers constructed from
polymer materials.
- Custom APEC
- Chip carrier packages constructed from Polymer materials that are
designed and manufactured by MDL to a specific customer requirement.
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- Chip On Board
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Chip on Board (COB) devices constructed from Polymer materials offers potentially smaller, cheaper and more powerful designs compared to
conventional through-hole assembly techniques and surface mount..
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- Multi Chip Modules
- Multi Chip Modules (MCM) are leadless chip carrier packages that contain several chips
with interconnection. They are constructed from Polymer materials and are
designed and manufactured by MDL to a specific customer requirement.
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Micro Devices Limited
