Micro Devices Limited

Packages for the Semiconductor & Micro Electronics industries

Services

 

Utilising their expertise in Leadless Chip Carriers, Chip on Board and Multi-Chip Modules, Micro Devices are able to work with clients to design, develop and manufacture innovative solutions for their products.

 
bullet Product Design: Design and layout capability for LCC, COB, and MCM; We can design and layout your semiconductor package or COB product, produce working drawings for approval and then provide full manufacturing CAD/CAM data.
bullet Application Support: We can advise on application and assembly techniques for die attach, wire bond and surface mount integrations for chip on board/multi chip module applications.
bullet Prototype Assembly: We can advise on assembly techniques for surface mount and chip and wire applications and produce specifications for final product assembly.
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PCB Layout Service: Conventional, double sided and multilayer PCB Analogue and digital, including high speed signals, differential pairs and matched length layout service.

bullet PCB Procurement: We can supply PCBs from our internal designs or from CAM files (Extended Gerber, NC drill files, etc) supplied by you.
bullet 2D / 3D Mechanical CAD Design: We can create full drawing sets for any application you may have.

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